Stealth_diced_Si_wafer_150µm_430x400_MB11.png
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Summary
| Description |
English:
Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 µm thickness, compare
M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, S. Nordhoff (2010). "
Separation of extremely miniaturized medical sensors by IR laser dicing
".
J. Opto. Adv. Mat.
12
: 479-483.
|
| Date | |
| Source | Own work |
| Author | MBirkholz |
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