A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire^[1] to dice, cut, or groove semiconductor wafers, and glass, ceramic, crystal, and many other types of material.

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The thickness of the cutting blades used varies with the material being cut, and is of about 20 μm to 35 μm when cutting silicon wafers^{[citation needed]}. Japanese companies, such as DISCO Corporation and Accretech (Tokyo Seimitsu), account for about 90% of dicing saw sales^{[citation needed]}. In the past, cutting 1/2 to 2/3 of wafer thickness was the mainstream; with large diameter wafers on dicing tape, full cut cutting is becoming mainstream^{[citation needed]}.

• Diamond tools
• Disco Corporation – a manufacturer of dicing saws