Intel_Core_M
Intel Core M is a family of ultra low-voltage microprocessors belonging to the Intel Core series and designed specifically for ultrathin notebooks, 2-in-1 detachables, and other mobile devices. The thermal design power (TDP) of all Core M microprocessors is 5 watts or lower. Intel Core M microprocessors are generally used in fanless devices due to their low TDP.
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Broadwell microarchitecture (5th generation)
"Broadwell-Y" (SoC, dual-core, 14 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache.
- All models except M-5Y10a and M-5Y70 support Configurable TDP.
- M-5Y70 and M-5Y71 also support Intel vPro.
- GPU and memory controller (up to 2 × DDR3-1600) are integrated onto the processor die.
- Peripherals include 12 lanes of PCI Express 2.0, in x4, x2, and x1 configurations.
- Package size: 30 mm × 16.5 mm
- Transistors: 1.3 billion
- Die size: 82 mm²
More information Model, sSpec number ...
| Model | sSpec number |
Cores | Clock rate | Turbo | L2 cache |
L3 cache |
GPU model |
GPU frequency |
TDP | Socket | I/O bus | Release date | Part number(s) |
Release price (USD) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Core M-5Y10 |
|
2 | 800 MHz | 2 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 100–800 MHz | 4.5 W
|
BGA-1234 | DMI 2.0 | September 2014 |
|
$281 |
| Core M-5Y10a |
|
2 | 800 MHz | 2 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 100–800 MHz | 4.5 W
|
BGA-1234 | DMI 2.0 | September 2014 |
|
$281 |
| Core M-5Y10c |
|
2 | 800 MHz | 2 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–800 MHz | 4.5 W
|
BGA-1234 | DMI 2.0 | October 2014 |
|
$281 |
| Core M-5Y31 |
|
2 | 900 MHz | 2.4 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–850 MHz | 4.5 W
|
BGA-1234 | DMI 2.0 | October 2014 |
|
$281 |
| Core M-5Y51 |
|
2 | 1.1 GHz | 2.6 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–900 MHz | 4.5 W
|
BGA-1234 | DMI 2.0 | October 2014 |
|
$281 |
| Core M-5Y70 |
|
2 | 1.1 GHz | 2.6 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 100–850 MHz | 4.5 W
|
BGA-1234 | DMI 2.0 | September 2014 |
|
$281 |
| Core M-5Y71 |
|
2 | 1.2 GHz | 2.9 GHz | 2 × 256 KB | 4 MB | HD Graphics 5300 | 300–900 MHz | 4.5 W
|
BGA-1234 | DMI 2.0 | October 2014 |
|
$281 |
Close
Skylake microarchitecture (6th generation)
"Skylake-Y" (SoC, dual-core, 14 nm)
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
- m5-6Y57 and m7-6Y75 also support Intel vPro, Intel TXT.
- GPU and memory controller (up to 2 × DDR3-1866) are integrated onto the processor die.
- Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
- Package size: 20 mm × 16.5 mm
- Transistors: TBD
- Die size: TBD
More information Model, sSpec number ...
| Model | sSpec number |
Cores (threads) |
Clock rate | Turbo | L2 cache |
L3 cache |
GPU model |
GPU frequency |
TDP | Socket | I/O bus | Release date | Part number(s) |
Release price (USD) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Core m3-6Y30 |
|
2 (4) | 900 MHz | 2.2 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–850 MHz | 4.5 W
|
BGA 1515 | DMI 3.0 | September 2015 |
|
$281 |
| Core m5-6Y54 |
|
2 (4) | 1.1 GHz | 2.7 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–900 MHz | 4.5 W
|
BGA 1515 | DMI 3.0 | September 2015 |
|
$281 |
| Core m5-6Y57 |
|
2 (4) | 1.1 GHz | 2.8 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–900 MHz | 4.5 W
|
BGA 1515 | DMI 3.0 | September 2015 |
|
$281 |
| Core m7-6Y75 |
|
2 (4) | 1.2 GHz | 3.1 GHz | 2 × 256 KB | 4 MB | HD Graphics 515 | 300–1000 MHz | 4.5 W
|
BGA 1515 | DMI 3.0 | September 2015 |
|
$393 |
Close
Kaby Lake microarchitecture (7th/8th generation)
"Kaby Lake-Y" (SoC, dual-core, 14 nm)
Core m5 and Core m7 models were rebranded as Core i5 and Core i7.
- All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, SGX, MPX, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Intel VT-d, Hyper-threading, Turbo Boost, AES-NI, Smart Cache, Configurable TDP.
- GPU and memory controller (up to 2 × LPDDR3-1866) are integrated onto the processor die.
- Peripherals include 10 lanes of PCI Express 3.0, in x4, x2, and x1 configurations.
- Package size: 20 mm × 16.5 mm
- Transistors: TBD
- Die size: TBD
More information Model, sSpec number ...
| Model | sSpec number |
Cores (threads) |
Clock rate | Turbo | L2 cache |
L3 cache |
GPU model |
GPU frequency |
TDP | Socket | I/O bus | Release date | Part number(s) |
Release price (USD) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Core m3-7Y30 |
|
2 (4) | 1 GHz | 2.6 GHz | 2 × 256 KB | 4 MB | HD Graphics 615 | 300–900 MHz | 4.5 W
|
BGA 1515 | DMI 3.0 | September 2016 |
|
$281 |
| Core m3-7Y32 |
|
2 (4) | 1.1 GHz | 3.0 GHz | 2 × 256 KB | 4 MB | HD Graphics 615 | 300–900 MHz | 4.5 W
|
BGA 1515 | DMI 3.0 | April 2017 |
|
$281 |
Close
"Amber Lake-Y" (dual-core, 14 nm)
More information Model, sSpec number ...
| Model | sSpec number |
Cores (threads) |
Clock rate | Turbo | L2 cache |
L3 cache |
GPU model |
GPU frequency |
TDP | Socket | I/O bus | Release date | Part number(s) |
Release price (USD) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Core m3-8100Y |
|
2 (4) | 1.1 GHz | 3.4 GHz | 2 × 256 KB | 4 MB | HD Graphics 615 | 300–900 MHz | 5 W
|
BGA 1515 | DMI 3.0 | August 2018 |
|
$281 |
Close
- System on a chip (SoC)