DO-15

DO-204

DO-204 is a family of diode semiconductor packages defined by JEDEC. This family comprises lead-mounted axial devices with round leads. Generally a diode will have a line painted near the cathode end.

1N4148 axial diodes, in the glass DO-35 package (also known as DO-204-AH or SOD27)

Dimensions

General form of the packages described by DO-204. Lead diameter is not controlled less than E from the body to allow for minor irregularities.
More information Variant, Original standard ...

Common variants

A drawing of a DO-41 diode package. The cathode is marked with a silver or white band.

Several common packages are archived in DO-204 as variants, and may be referred to using their alternative names.

DO-7

The DO-7 (also known as DO-204-AA) is a common semiconductor package for 1N34A germanium diodes.[3][12]

DO-35

The DO-35 (also known as DO-204-AH or SOD27) is a semiconductor package used to encapsulate signal diodes (i.e., diodes meant to handle small amounts of current and voltage).[10][13][2] It is often used to package small signal, low power diodes such as 1N4148 (a 100 V, 300 mA silicon diode.)

DO-41

The DO-41 (also known as DO-204-AL or SOD66) is a common semiconductor package used to encapsulate rectifier diodes (i.e., diodes meant to handle larger currents and voltages than signal diodes).[11][14] The name is derived from the JEDEC descriptor "Diode Outline, Case Style 41".[2] DO-41 diodes are larger than signal diode packages such as DO-35, which are not required to handle large currents. The most common diode using this packaging is the 1N4001 to 1N4007 series of rectification diodes.

National standards

More information Standards organization, Standard ...

References

  1. "JEDEC DO-204 family package specification" (PDF). JEDEC. January 20, 1976. Archived from the original (PDF) on October 10, 2008.
  2. "Master Index for JEDEC 95 Outlines and Standards" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017. Retrieved June 16, 2017.
  3. "JEDEC DO-7 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
  4. "JEDEC DO-14 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
  5. "JEDEC DO-15 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
  6. "JEDEC DO-16 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
  7. "JEDEC DO-26 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
  8. "JEDEC DO-29 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
  9. "JEDEC DO-34 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
  10. "JEDEC DO-35 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
  11. "JEDEC DO-41 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
  12. "Semiconductors" (PDF). Pro Electron. 1978. pp. 215–221. Retrieved 2021-06-17.
  13. "TGL 26713/12: Gehäuse für Halbleiterbauelemente - Bauform M" [Outline drawings for semiconductor devices; Type M] (PDF) (in German). Leipzig: Verlag für Standardisierung. June 1988. Retrieved 2021-06-15.
  14. "Semiconductor Databook" (PDF). Heilbronn: AEG-Telefunken. p. 8. Retrieved 2021-08-20.
  15. "Diodes - Zener Diodes - Rectifiers - Thyristors" (PDF). Freiburg: ITT. 1977. p. 218. Retrieved 2021-11-05.
  16. "TGL 200-8380: Halbleiterbauelemente - Halbleiterdioden Verlustleistung unter 1 Watt - Bauformen" [Semiconductor Devices - Designs for Semiconductor Diodes - Dissipation power less 1 Watt] (PDF) (in German). Leipzig: Verlag für Standardisierung. 1981. Retrieved 2021-07-12.

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